| 摘要 |
To improve the efficiency of cooling in an air cooled electronic assembly of finned electronic modules (10) mounted on a board (100) which forms an enclosure for the modules with a cover (40), the cover is individually apertured for each module so that an individual cooling air stream is provided for each module which flows towards the board, rather than across the board, through a substantial portion of the fins. Cooling air is moved by a dual pull air moving mechanism (26, 28, 30) venting to atmosphere through failsafe flaps (50). Each opening (42) in the cover has its own cooling adjustment slides (52). Air exhaustion is by way of air channels (34) between the modules and not by way of other modules, such secondary impingement being prevented by cross flow baffles (38), relative fin rotation and by air flow guides (44). |
