| 摘要 |
Alloy comprises 70-80 wt.% Mn, 20-28 wt.% Ni with a max. of 2% Cu and the normally occurring contaminants. It has a high thermal expansion coefft. and is used as a component in thermal bimetal devices. In an example, the alloy has 74.1% Mn, 26.4% Ni, 1.0% Cu, Fe and Si 0.1% each and remaining contaminants 0.1%. The thermal expansion coefft. is 27.6 x 10 power -6 deg.C power -1. The material is combined to form a bimetal strip with another material comprising 36.5% Ni, 0.5% Mn, 0.2% Si, remaining materials being less than about 0.4% and the rest, Fe. Its thermal coefft. of expansion is 1.5 power -6 deg.C power -1. The bending as measured according to DIN1715 in 20.6 x 10 power -6. (Provisional Basic previously advised in WeekK18) |
