Molding of electronic components

摘要

Electronic components are encapsulated by apparatus which includes two superposable carrier plates 102, 104 made of plastics material, the carrier plates being arranged to define a cavity (106,108) when superposed. Electronic components e.g. a metal lead frame, are positioned appropriately and plastics encapsulating material is introduced under pressure to surround the components. Pressure is applied to the carrier plates for a time period sufficient to compress and mold the encapsulating material about the components and to allow setting and hardening of the encapsulating material.