| 摘要 |
PURPOSE:To obtain a thin sheet having no irregularity by a method wherein a cap is provided through a bonding resin in such a way that a semiconductor chip is covered and moreover, external lead-out terminals are exposed. CONSTITUTION:A module substrate 11b is provided with a wiring layer 7b, bonding pads 8b, external lead-out terminals 9b, protruding terminals 13b and a device hole 10b, in which an IC chip 2 is put, of the substrate and the IC chip 2b is subjected to lead-bonding in this device hole 10b. On the IC chip 2b, leads 4b are subjected to lead-bonding on the electrodes of the IC chip 2b and the bonding pads 8b of the module substrate 11. A cap 14b is provided through a bonding resin 15b in such a way that the IC chip 2b of the module substrate 11b and its vicinity are covered and also, at least the parts of the external leadout terminals 9b are exposed. Thereby, the irregularities of a cover sheet, which are generated on the IC chip and its neighboring part, can be prevented. |
