| 摘要 |
PURPOSE:To bake the wafer automatically and positively by transporting a carrier, on which the wafer is placed, along a guide groove for the carrier, taking the carrier in and out in the direction of the ceiling of the guide groove by means of a lifter and shifting the wafer between a hot plate and the carrier. CONSTITUTION:The belts 21, 22 travel along the guide grooves 71, 72 while placing the wafers 3 from one side of the hot plate 7, and are stopped at predetermined positions. The lifter 10 is actuated and the belts drop to the bottoms of the guide grooves, and the wafers 3 are shifted onto the hot plate 7. When baking is completed, the lifter 10 is operated, the belts are elevated, and the wafers are carried, and transported outside the hot plate along the grooves. According to this constitution, temperature is simply controlled, treating time is shortened, and the device is easily automated. |
