发明名称 IMPROVEMENTS IN THE ELECTROLESS METALLIZING OF SUBSTRATES
摘要 1,247,991. Printed circuits. SHIPLEY CO. Inc. 13 May, 1969 [15 May, 1968], No. 24274/69. Heading H1R. [Also in Division C7] A printed circuit board which may be either a plastics, e.g. phenolic, sheet or a copper-clad plastics laminate is electroless plated at selected parts with e.g. Ni or Cu, by treating those parts, e.g. chemically, by mechanical roughening, or by applying a resist, to make them more retentive to a colloid, covering the substrate with a catalytic colloid, e.g. PdCl 2 , Au or Au-Pd, contacting the board with a stripper to remove the colloid from the untreated parts of the substrate and then electroless plating. The board may be subsequently electroplated with Cu and then a Pb-Sn alloy. The process may be used to deposit Cu on the through holes of a board.
申请公布号 GB1247991(A) 申请公布日期 1971.09.29
申请号 GB19690024274 申请日期 1969.05.13
申请人 SHIPLEY COMPANY INC. 发明人
分类号 A43B13/02;C23C18/16;C23C18/22;C23C18/30;C23C18/31;C23C18/34;C23C18/40;H05K3/18 主分类号 A43B13/02
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