| 摘要 |
PURPOSE:To prevent the formation of foam in the liquid layer that is applied onto a rotating body and prevent splashing of the liquid by providing a needle at the end of the opening along which the liquid drips. CONSTITUTION:A support 6 is mounted on the tip end of a pipe 5. At the tip end of the support 6 a grid plate 8 is provided, and at the center of the grid plate 8 a needle 7 is provided. when a resist liquid is dripped along the needle 7 onto a semiconductor wafer smoothly, the resist liquid never forms large resist drips at the end of the opening for pouring the resist liquid. The liquid drops down smoothly onto the semiconductor wafer. Accordingly the resist liquid layer formed by applying the liquid onto the rotating wafer has no foam, nor does the resist liquid splash on the wafer surface, producing a uniform film with high yield. |
