发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the warp of a case and heat sink and the separation of the heat sink by providing an adhesive agent layer at almost the center between the casing and heat sink and by further providing an antifreezing and flexible resin layer in the region, except for this adhesive agent layer. CONSTITUTION:A casing 11 is composed of the ceramic case 12 sealing an LSI and plurality of pins 13... implanted downward along the lengthwise side of said case 12. At almost the center of upper part of the case 12, an adhesive agent layer 14 having excellent moisture proof characteristic is provided, and further at the upper part of the case 12 an aluminum heat sink 15 is provided through the adhesive agent layer 14, and an antifreezing and flexible resin layer 16 is formed in the region except for the adhesive agent layer 14 between the case 12 and heat sink 15.
申请公布号 JPS5843547(A) 申请公布日期 1983.03.14
申请号 JP19810141297 申请日期 1981.09.08
申请人 TOKYO SHIBAURA DENKI KK 发明人 IWAMURA ATSUSHI
分类号 H01L23/40;H01L23/373 主分类号 H01L23/40
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