| 摘要 |
PURPOSE:To improve the reliability and yield of a semiconductor device making diburring needless in assembling process by a method wherein the perphery part of cathode electrode plate is bent toward the cathode terminal plate. CONSTITUTION:The periphery parts 25a of the cathode electrode 25 lying between a cathode terminal plate 26 and a semiconductor element 20 are bent toward said terminal plate 26 at the bending angle of 10-50 deg. to prevent the burrs formed at the edges of said terminal plate 26 from coming into contact with the gate 20a of said elemet 20 even if the high pressure of 200-500kg/cm2 is loaded between said terminal plate 26 and an anode terminal plate 24. Consequently, the reliability and yield of said element 20 may be improved as said gate 20a and said terminal 26 are prevented from shortcircuiting with each other further improving the workability of said terminal 26 due to the diburring made needless. |
