| 摘要 |
<p>1306201 Electroless plating KOLLMORGEN CORP 18 Jan 1971 [5 Feb 1970] 2327/71 Heading C7F A sensitizing solution for applying to or incorporating in a substrate prior to the electroless plating of e.g. Cu comprises a complex formed from (a) a precious metal selected from the fifth and sixth periods of Groups VIII and 1B, (b) a Group IV metal capable of two valence states, and (c) an anion capable of forming a stable moiety with both valence states, of the Group IV metal, the molar ratio of components (a), (b), (c) being 1:1:3 to 1:6:24, the complex being formed by heating, at e. g 80‹C to boiling point, an aqueous mixture of the components. The precious metal may be Pd, Pt, Au, Rh, Os, Ir, and the Group IV metal stannous tin, Ti, Ge. The anion may be chloride, bromide, fluoride, fluoborate, iodide, nitrate, sulphate, acetate. The solution may contain an organic solvent, e.g. cyclohexanone, dimelthylformamide, hexane, and dimethyl sulphoxide. The solution may also contain a stabilizer, e.g. methanol, ethanol, i-propanol, ethylene glycol, propylene glycol, 1, 4-butane diol, glycerol, glucose, sucrose, cyclohexanol, cyclohexanediol, inositol, phenol, #-naphthol, resorcinol, catechol hydroquinone, pyrogallol, phloroglucinol or naphthoresorcinol.</p> |
