| 摘要 |
A system for automaticlaly fabricating and bonding semiconductor devices using lead frames and semiconductor chips, which comprises means for supplying a continuous strip of lead frames, an automatic die bonder for mounting semiconductor chips on the lead frames and forming sheets thereof, buffer means for temporarily storing the sheets formed of the lead frames and semiconductor chips mounted thereon, and at least one automatic wire bonder, all of these apparatus being arranged in a line.
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