| 摘要 |
PURPOSE:To contrive to curtail the number of man-hour, while to enhance reliability of a semiconductor device by a method wherein the edge part of a metal plate provided on the bottom of the concave part at the center part of the upper surface of a substrate is bent upward along the circumferential wall face of the concave part, and is connected to the necessary object out of metal leads on the circumferential part of the upper surface. CONSTITUTION:The concave part 6 is provided at the center part on the upper surface of the ceramic base 3, the metal plate 17 is adhered thereto with glass 5 for adhesion, and moreover a semiconductor element 1 is laminated thereon interposing an eutectic metal solder material between them. The edge part 18 of the metal plate 17 is bent, and is made to lie along the circumferential wall of the concave part 6. The necessary object out of the bent parts 11 of the metal leads 4 adhered with glass 5 to the circumferential part on the upper surface of the ceramic base 3 and the metal edge part 18 are soldered with a metal solder material 19. A surface electrode 2 of the semiconductor element 1 is connected to the edge part 9 of another metal lead 4 bonding a metal fine wire 10. A cap 13 is covered thereon using ceramic glass 14 to form the package. Accordingly the number of man-hour is curtailed, and reliability of the manufactured product is enhanced. |
