| 摘要 |
PURPOSE:To enble to attain favorable sealing of a hybrid integrated circuit device accommodating vessel by a method wherein a cover is put on the necessary table, the vessel main body turned the open side thereof downward is put thereon interposing a solder layer between them, the temperature thereof is made to rise at the temperature of the melting point of the solder layer or more, and after the vessel main body and the cover are rubbed mutually, the vessel is cooled. CONSTITUTION:Previous solder 5 is applied to the adhering regions of the vessel main body 1 and the cover 3 using flux previously, and remaining flux is removed. The vessel main body 1 applied with previous solder 5 is put on the cover 3 applied with previous solder 5 turning the open side thereof downward, and the parts of the previous solder 5 of both are made to come in contact mutually. The whole is put on a hot plate 4 in this condition, the temperature is made to rise at the melting point of solder or more, and the vessel main body 1 is oscillated for several times in the lateral direction pressing a little against the cover 3 to attain favorable intimacy with the cover 3. After then, the vessel is cooled from the cover 3 side. The operation thereof is performed in the atmosphere of low concentration of oxygen. The operation thereof may be performed as to make the temperature to rise pinching preform solder between the cover 3 and the vessel main body 1 without applying previous solder. |
