发明名称 WAFERBOARD PROCESS
摘要 A process for the preparation of a wood chip board wherein a particulate wood chip furnish is admixed with a binding agent and thereafter formed into a board, which process includes the steps of: (a) optionally adjusting the water content of the particulate wood chip furnish to a first desired level; (b) coating the particles of the wood chip furnish over a substantial portion of their surface area with a binder by contacting the wood chip furnish with a solution, suspension or dispersion of a binding agent in a solvent, whereby less than 15% by weight of binder, based on the dry weight of the wood chip furnish, is coated onto the furnish; (c) adjusting the water and/or other volatile solvent content of the coated particulate furnish to a second desired level; and (d) forming the thus treated furnish into a wood chip board under the influence of heat and pressure. This process is capable of providing a wood chip board having the same strength, etc., properties as a plywood, and is thus useful in construction application. p
申请公布号 PH15646(A) 申请公布日期 1983.03.11
申请号 PH20020000228 申请日期 1979.07.20
申请人 REICHHOLD LTD 发明人 ZUDAN KRISHAN KUMAR;BERCHEM ANTOINE
分类号 B27N3/02;B27N3/00 主分类号 B27N3/02
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