| 摘要 |
1,255,073. Circuit assemblies. FERRANTI Ltd. 13 May, 1970 [20 May, 1969], No. 25693/69. Heading H1R. An electric circuit assembly consists of a plurality of components, including at least one semi-conductor device, mounted on a network of conductors, which is in the form of a lead frame formed from a metal sheet. The semi-conductor device, and the adjacent parts of the conductor network, are encapsulated in a potting compound; the encapsulation acting as a support for the conductors connected to the semiconductor device. The whole assembly may also be subsequently encapsulated in a suitable compound. Fig. 1 shows an amplifier circuit in one stage of production, before encapsulation. An integrated circuit 11, and a transistor 12 are mounted on the conductor network 10. The network 10 may be made by stamping out the desired apertures in a thin sheet of a suitable nickel-iron-cobalt alloy, or by selectively etching such a sheet, and is coated with gold. The boundary frame 17 may act just as a support to the network, by breaking the extension pieces 21B near the frame 17 and applying an insulating band across 21A and 21B, or may also act as a conductor, by keeping 21B complete. Cross-leads 22, 22A and 22B act as support means during construction, and are later broken off. The leads 22A and 22B also enable the semi-conductor devices to be tested separately after they have been encapsulated, but before the whole assembly is encapsulated. The parts 24 of the leads are provided for connections to be made to components. The semiconductor devices 11 and 12 and the adjacent leads are separately encapsulated in potting compounds, and the whole assembly is then encapsulated in a different potting compound. The support frame may then be broken away altogether, if it is not required as a conductor. |
