| 摘要 |
PURPOSE:To improve the reliability of a thin film wiring circuit, by superposing layers heterogeneous with each other on a substrate, projecting the first layer end part out from the second layer end part and the second layer end part out from the third layer end part and superposing a metallic layer. CONSTITUTION:TaN, Ti and Au are laminated on an insulating substrate 11 and photo-etched resulting in the pattern of the Au 41. Next, the Ti layer 31 is etched, the top end 33 thereof is projected out from the top end 42 of the Au 41, subsequently the TaN 21 is etched, and accordingly the top end 22 thereof is projected out from the top end 33 of the Ti layer 31. When using the etchant of HF: HNO3:H2O=5:1:1, the Ti is etching-removed faster than TaN, and the end part 33 can be formed back from the end part 22. Succeedingly, conductor patterns of nichrome 51 and Au 61 are so formed as to be superposed on the part A or the entire surface of the pattern. In this structure, an intermediate layer has no hollow parts, and the manufacturing yield and reliability are greatly improved. |
