发明名称 TIE BAR METAL MOLD FOR RESIN SEALING OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the abrasion of a punch and securely deburr, by constituting a metal mold used for a lead forming process of a resin cut punch and of burr receiving blocks which clamp burrs generated on a resin part therebetween and fall in interlocking with the punch fall. CONSTITUTION:A lead frame 1 which is finished forming is supplied onto a resin cut die 7, a resin cut punch 6 is lowered, and thus burrs 5 generated on both sides of the resin part 2 are clamped by the punch and burr receiving blocks 8 provided in the die 7. Next, burrs 5 are punched in clamping by further lowering the punch 6, and simultaneously the burr receiving blocks 8 are lowered in interlocking therewith. Thereafter, only the punch 6 is raised, and the frame 1 completed in resin cut is took out. Next, blocks 8 are raised, and burrs 5 which are separated off are removed preparing for a next deburring.
申请公布号 JPS5840834(A) 申请公布日期 1983.03.09
申请号 JP19810139887 申请日期 1981.09.03
申请人 MITSUBISHI DENKI KK 发明人 TAKEMURA SEIJI
分类号 H01L23/50;B29C33/00;B29C37/02;B29C61/00;H01L21/56 主分类号 H01L23/50
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