发明名称 METHOD FOR GROWING SILICON EPITAXIAL FILM
摘要 PURPOSE:To obtain a high-quality grown film having a few crystal defect and no impurity crawling from a substrate by a method wherein HCl is included in a silicon compound which is original gas when an epitaxial film is grown on a semiconductor substrate by vacuum vapor reactor. CONSTITUTION:A plurality of P type Si substrates are vertically erected with some space in a quartz reaction tube and the reaction tube is heated at 1,050 deg.C by using an electric furnace and pressure is reduced to 2 Torrs by a rotary pump. Next, H2, SiHCl3, PH3, HCl are poured into the reaction tube for 30min at a flow rate of 20l, 400cc, 10cc and 200cc per minute respectively and an N type layer is epitaxially grown on the surface of an Si substrate. In this way, the grown layer having a few crystal defect is obtained.
申请公布号 JPS5840821(A) 申请公布日期 1983.03.09
申请号 JP19810138630 申请日期 1981.09.04
申请人 FUJITSU KK 发明人 FURUMURA YUUJI;NISHIZAWA TAKESHI
分类号 H01L21/205;(IPC1-7):01L21/205 主分类号 H01L21/205
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