发明名称 DEPOSITION OF THICK CHROMIUM FILMS FROM TRIVALENT CHROMIUM PLATING SOLUTIONS
摘要 A process for plating thick chromium coatings for engineering applications comprises depositing a thin initial layer from a low concentration chromium III/thiocyanate bath and depositing the bulk of the remaining thickness from a relatively higher concentration chromium III/thiocyanate bath. Deposits produced by this two-stage process are more cohesive and smoother than those obtainable by plating the entire thickness from the high concentration bath alone.
申请公布号 GB2051861(B) 申请公布日期 1983.03.09
申请号 GB19790022791 申请日期 1979.06.29
申请人 IBM CORP 发明人
分类号 C25D3/06;(IPC1-7):25D5/14 主分类号 C25D3/06
代理机构 代理人
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