发明名称 INSPECTION METHOD OF PACKAGING PRINTED CIRCUIT SUBSTRATE
摘要 PURPOSE:To detect errors and positions of parts on a printed circuit substrate, by making a light and darkness boundary line by a projector on the surface of the printed circuit substrate and obtaining the data of a profile line by photographing the parts on the substrate which is passing the boundary line by a video camera. CONSTITUTION:A printed circuit substrate 1 which is transported is arranged so that the right side of a light and darkness boundary surface Z including an optical axis which is vertical to the substrate 1 is projected by a slit 21 of a projector 2 and the left-side light is shielded. A television camera 3 is arranged so that the optical axis forms 90 deg.-theta angle to an irradiated area Za side against the boundary surface Z, and a scanning direction is arranged so that a horizontal amplitude direction forms right angles to the direction of a boundary line Y between an irradiated area Za and a light shielded area Zb made on the substrate 1. By operating the profile line data of the Y axial direction obtained from a length of the light and darkness part of the Y axial direction, an outer profile in a width direction is decided. Then, the substrate 1 is moved to a prescribed distance and the profile line data in an X axial direction is obtained and the outer profile of a part 13 in the thickness direction is decided. The shape of the part 13 is specified from these data.
申请公布号 JPS5839933(A) 申请公布日期 1983.03.08
申请号 JP19810138961 申请日期 1981.09.02
申请人 MITSUBISHI DENKI KK 发明人 SAKAGAMI YOSHIKAZU
分类号 G01N21/88;G01B11/25;G01N21/956 主分类号 G01N21/88
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