发明名称 |
Curable epoxy resin compositions |
摘要 |
The invention provides a novel curable epoxy resin composition suitable for resin encapsulation of various electronic devices such as transistors, ICs, LSIs and the like with high anti-moisture resistance and without causing excessive stress upon curing to the electronic devices. The resin composition comprises an epoxy resin, a curing agent such as a phenol novolac resin, a filler and a curing catalyst such as an imidazole compound as well as an organosilicon polymer represented by the general formula <IMAGE> in which R is a monovalent hydrocarbon group such as methyl, Z is a divalent organic group such as ethylene and phenylene, n is a positive number of at least 10 on an average and a and b are each zero or a positive number not exceeding 1 with the proviso that a+b is in the range from 1 to 2 inclusive, in a limited amount.
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申请公布号 |
US4376174(A) |
申请公布日期 |
1983.03.08 |
申请号 |
US19810243252 |
申请日期 |
1981.03.12 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
ITOH, KUNIO;TAKAMURA, TOORU |
分类号 |
C08G59/00;C08G59/40;C08L63/00;H01B3/40;H01L23/29;(IPC1-7):C08L63/00 |
主分类号 |
C08G59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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