发明名称 FRAME ASSEMBY FOR ELECTRONIC COMPONENTS
摘要 <p>Case 2744 FRAME ASSEMBLY FOR ELECTRONIC COMPONENTS The present invention provides a dielectric paper frame structure suitable for use in a shell-type housing for supporting a small number of discrete electronic components in spaced-apart, non-contacting and electrically insulating relation from the walls of the housing. The frame structure comprises a thin elongated unitary piece of dielectric paper having two opposing major surfaces and two edges in contact with opposing walls of the housing. Along the edges of the frame structure there are provided substantially V-shaped slots which receive non-insulated leads of the electrical components such that the electrical components are located between the edges of the frame structure. The novel paper frame structure replaces a printed circuit board.</p>
申请公布号 CA1142634(A) 申请公布日期 1983.03.08
申请号 CA19800352593 申请日期 1980.05.23
申请人 CANADIAN GENERAL ELECTRIC COMPANY LIMITED 发明人 CHIPPEL, BOB M.
分类号 H05K5/00;(IPC1-7):H05K7/14;H05K7/18 主分类号 H05K5/00
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