| 摘要 |
<p>PURPOSE:To reduce the output of a light emitting element in an electronic circuit device which has an element for transmitting at least part of information via light by forming a reflecting film made of a dielectric film such as SiO2 or Si3N4 on the inner surface of an alumina package, thereby effectively transmitting information between the elements even in the package of the electronic circuit of complicated shape. CONSTITUTION:A semiconductor integrated circuit substate 3 having a light emitting unit 2 is installed on an insulating substrate 1, and a semiconductor integrated circuit substrate 5 having a photodetector 4 is mounted on the substrate 1. A reflection film 7 which is made of substance that satisfactorily reflects the light such as semi-metal such as metal like Al or polycrystalline silicon is formed except the periphery of the part to mount the substrates 3, 5 on the inner surface of an enclosure 6 made of alumina or the like. The light emitted from the unit 2 is effectively arrived at the photodetector 4 even in weak light by the influence of the film 7, thereby enabling to transmit the signal from the substrate 3 to the substrate 5. Even if an obstacle such as projection 13 is existed in the package between the substrates 3 and 5, a light signal can be transmitted.</p> |
