| 摘要 |
<p>PURPOSE:To perform a dividing method without scratching the surface of a semiconductor wafer by placing and treating the wafer on a film having air permeability and adhesive surface. CONSTITUTION:Pressure reducing means 4 is disposed at the center of a base 3a which places a frame 1 mounted with a film 2. A wafer 5 is placed on the film 2 which is placed on a suction base 4b, and since the film 2 has air permeability, the wafer 5 can be effectively sucked and bonded to the film 2 by the suction of the base 4b. No article is contacted on the surface of the wafer 5. The wafer 5 is divided into a plurality of chips 5a. In this case, the film 2 may not be cut. Thereafter, the film 2 is drawn in the radial direction to isolate the plural chips 5a. Air from a diffuser 8 is fed under the prescribed pressure, and the film 2 is lifted from below as designated by an arrow (a) to isolate the chips 5a from the film 2 to raise the chips 5a together with a jig 6 to the prescribed position.</p> |
