| 摘要 |
PURPOSE:To enble to produce power and ground from a die bond region and to efficiently mount a semiconductor integrated circuit chip with less impedance by dividing the die bond region into two and more in a package for a semiconductor device. CONSTITUTION:Conductor layers 202, 203 are formed of Au plating or metallic foil, and 204-207 are leads for connecting to the external unit. The layer 202 of the die bond region is connected through a metallic wire 208 formed in the ceramic substrate to an external lead 204, and the layer 203 is connected through a metallic wire 209 to external lead 207. Semiconductor elements are respectively formed on semiconductor substrates 302-305, and are provided with common power wire 306, and common ground wire 307. When a stereoscopic semiconductor integrated circuit laminated with multilayers with semiconductor substrates is employed, the wire can be effectively formed only by dividing the die bond region. |
