发明名称 LEAD FRAME FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To eliminate the penetration of humidity, contaminated ions, etc. through a support, and the adhesion of noble metallic plating to mounting part and supporting part by a method wherein the mounting part is supported by combining with external loading leads by an insulator. CONSTITUTION:An insulator 6 that is adhered to a plastic envelope consists of a resin sheet or film leaf whose coefficient of thermal expansion and hygroscopic swelling are close to those of the envelope, and is adhered to mounting part 1 and external loading leads 4a-4n, as well as covering them. As a result, a microgap does not exist between plastics, the envelope, that grows along a support part, and metal comprising the support part, thus this extremely lessens the penetration of a harmful object. In addition, the mounting part is isolated electrically from the part with electric potential by plating, therefore the adhesion of noble metallic plating to the mounting part can be easily avoided.
申请公布号 JPS5837940(A) 申请公布日期 1983.03.05
申请号 JP19810135587 申请日期 1981.08.31
申请人 OKI DENKI KOGYO KK 发明人 TAKEISHI TATSUHIKO
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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