| 摘要 |
PURPOSE:To obtain uniform dust flow resistance to the surface of a substrate by a method wherein dummy parts are fitted to the both sides of an element substrate when resin coating is carried out by the flow dipping method, or projections are provided at the upper ends of both sides of a substrate. CONSTITUTION:An integrated circuit formed on the surface of a substrate 2 are formed by patterning at the central part of the substrate, and externally mounted elements such as semiconductor IC, chip components, etc. that are mounted on the substrate are also, in most cases, provided closely to the central part. Thus, the flow resistance of epoxy dust that flows by compressed air is smaller at the both sides than the central part of the substrate, and this causes a coated film to rise. There are two methods which make flow resistance uniform to prevent the above phenomenon. One is a method wherein dummy parts 7 are fitted to the both sides of the element substrate 2. The other is a method wherein a substrate having projections 8 at the upper ends of both sides of the substrate 2 is used. |
