| 摘要 |
PURPOSE:To facilitate the formation of wiring within a layer and between layers with short wires by using an inclined surface in tiers provided between semiconductor layers in a plurality of layers as a wiring region. CONSTITUTION:In each semiconductor layer, contacts are arranged for wiring within the layer and between layers on a tiered surface outside a semiconductor layer to be laid on top of the preceeding semiconductor layer. In so doing, after the laminated semiconductor layer is formed, wiring within the layer 3 and between the layers 4 can be formed by utilizing each of the tier surfaces of the inclined ones. As a result, it becomes possible not only to reduce an area exclusively occupied by the circuit three-dimensionally integrated but also to realize wiring within the layer and between the layers with short wires by using the inclined surface in tiers. Moreover, because the inclined surface in tiers is utilized for wiring and because wiring within the layer and between the layers can be collectively completed after the laminated semiconductor layer is formed, the manufacturing process is simplified. |
