VERFAHREN ZUM VERBINDEN EINES HALBLEITERCHIPS MIT EINEM CHIPTRAEGER

摘要

Method of joining a semiconductor chip to a chip carrier by cementing or soldering which includes treating an area of the semiconductor chip to be joined to the carrier with a laser beam, adjusting the energy of the laser beam to produce depressions by localizing melting of the semiconductor material of the chip and to at least partially pile melted semiconductor material at the edge of the depression, and applying cement or solder between the treated area of the semiconductor chip and the carrier.