发明名称 STRUCTURE OF EVAPORATION SOURCE FOR ALLOY VAPOR- DEPOSITION
摘要 PURPOSE:To form an alloy plating layer having a uniform component concentration ratio, by a simple control means, by evaporating each component metal for forming an alloy, in each separate vessel, leading it to a mixing chamber through a slit, and after that, vapor-depositing it to a material to be plated. CONSTITUTION:On the bottom part of a vapor mixing chamber 6, a vessel 1 of a low vapor pressure metal such as lead A, etc. is placed through slit S1-S3, and on the side wall of the mixing chamber 6, vessels 1', 1'' of a high vapor pressure metal such as zinc B, B', etc. are placed through slits S4, S5. By heaters 3-3'', lead A and zinc B, B' are heated, and its vapor is discharged into the mixing chamber 6 through the slits S1-S5, by which mixed vapor is generated. The inside of this mixing chamber 6 is held at a proper temperature by a heater 17, and mixed vapor of lead A and zinc B is discharged from an opening 7 and is vapor-deposited onto a steel band 5. Concentration of a component metal of a plating layer can be obtained easily by adjusting outputs of the heaters 3-3''. According to this method, a plating alloy component is stabilized, and a homogeneous vapor-deposited layer can be obtained.
申请公布号 JPS5834172(A) 申请公布日期 1983.02.28
申请号 JP19810132582 申请日期 1981.08.26
申请人 MITSUBISHI JUKOGYO KK 发明人 NAKAGAWA YOSHIKIYO
分类号 C23C14/24 主分类号 C23C14/24
代理机构 代理人
主权项
地址