| 摘要 |
PURPOSE:To obtain an electrically stable connection by relatively inclining a lead surface with respect to the terminal surface of a socket. CONSTITUTION:The end of a lead 3 which extends from the package 2 of a semiconductor device 1 is inserted into an insertion hole 5 of a socket 4, and is conducted by interposing between a pair of terminals 6 of the socket 4. The end of the lead 3 is twisted at 45 deg., and the lead is constructed to be contacted at the corner 7 with the flat surface of the terminal 6 of the socket 4. As a result, when the end of the lead 3 is inserted into an insertion hole 4, the corner 7 rubs the terminal surface of the socket 4, and a new element forming surface is presented at the terminal 6, thereby providing stable connection. |
