| 摘要 |
<p>PURPOSE:To prevent the isolation of a lead frame from a package substrate by constructing a package of a resin material mixed with filler having negative thermal expansion coefficient. CONSTITUTION:The lead frame 1 of chip carrier type package is formed, for example, of 42 alloy, and a semiconductor pellet 3 is bonded via a solder 2 to the inner lead side of the lead frame 1. The pellet 3 is sealed by a molded package 4 and a cap 5. The package 4 is mixed with filler having negative thermal expansion coefficient in the resin. Accordingly, the thermal expansion coefficient of the package 4 is similar to those of the pellet 3 and the frame 1, and the package 4 is not isolated from then.</p> |
