| 摘要 |
<p>PURPOSE:To improve the quality of mounting a semiconductor device by pressing by a collet a pellet on a substrate at the end of the collet, applying a microscopic motion to the substrate while the pellet is held steadily and scrubbing the surface of the substrate. CONSTITUTION:A collet 14 which attracts and supports a semiconductor pellet under reduced pressure at the end of an arm 13 crossing perpendicularly the conveying direction of a carrier is mounted at the top of the mount 11a of the carrier. The pellets 4 are sequentially removed from a tray 12 for the pellets, are conveyed on a substrate 1, and are pressed on a portion to be mounted. On the mount are provided a pulse motor 17 for scrubbing and screw couples 19 on a seat 18.</p> |
