| 摘要 |
PURPOSE:To align the positions of a chip and leads by inserting the right and left external leads of a lead pattern between the external leads of adjacent lead patterns and inclining the lead patterns with respect to the profile line of the lead frame, thereby saving the material. CONSTITUTION:A plurality of lead patterns, each of which has a plurality of leads 2 and a profile unit 3 at a semiconductor element placing part 2 as a center, are continuously formed at a lead frame. The right and left external leads 5 of the lead patterns are inserted between the external leads 5' of the adjacent lead patterns. Further, the lead patterns are inclined at the prescribed angle theta with respect to the profile line 6 of the lead frame. As a result, the element placing parts 1, 1' of the respective lead patterns are disposed on linear lines parallel to the profile line 6 of the lead frame. |
