| 摘要 |
PURPOSE:To improve the efficiency of a method of mounting lead wires by uniformly bending in advance the lead wires of an IC and an optical connector by an exclusively bending device, then inserting the wires into the lead wire mounting holes of a substrate and soldering the wires, thereby standardizing the mounting work. CONSTITUTION:The lead wires 2 of a hybrid IC1 are simultaneously bent in advance by a hybrid IC bending device, thereby providing uniform bents 63. Similarly, the lead wires 6, 7 of an optical connector 3 are bent by an optical connector lead bending device, thereby providing bents 64. Thereafter, an IC1 and the connector 3 are inserted into the lead wire mounting holes of a substrate 64. In this manner, the lead wires are soldered to the lead wires of the substrate at the back surface of the substrate 65. Thus, the lead wires are bent in advance by the exclusive bending device, and the positions and the angles of the bents become equal to each other. As a result, the mounting work is standardized, thereby improving the efficiency. |
