发明名称 INSPECTION FOR PATTERN DEFECT
摘要 PURPOSE:To detect foreign substances with a high reliability, by a method wherein a plurality of chips are transferred onto a substrate, and one of them is compared with another. CONSTITUTION:Foreign substances 104, 105 and circuit patterns 106 are on a reticle 103. The probability is substantially zero that the positions of the foreign substances on the respective chips and the configurations thereof are completely the same. When transferred images are formed on a photoresist on a transparent glass, transferred images 116 of the circuit patterns appear on the whole chips, but trasferred images 114, 115 of the foreign substances appear every two chips. Objective lenses 118, 119 are disposed above chips 112, 113 respectively, and a glass plate 107 is irradiated 120. The light is photoelectrically converted 121, 122 and amplified 123, 124 and then differentially amplified 125 before being delivered 126. A holder 117 is moved in the X and Y directions to detect the existence of a defect in the whole chip aea, i.e., the existence of a foreign substance on the reticle. By this constitution, the defect due to the transfer of a foreign substance on the reticle will not be a mutual defect, and a highly reliable detection can be performed.
申请公布号 JPS5832416(A) 申请公布日期 1983.02.25
申请号 JP19810111392 申请日期 1981.07.16
申请人 NIPPON DENKI KK 发明人 TAGUCHI TSUNEHIRO;WADA TOSHIO
分类号 G01N21/88;G01N21/93;G01N21/94;G01N21/956;G03F1/84;H01L21/027;H01L21/30;H01L21/66 主分类号 G01N21/88
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