APPARATUS FOR BENDING AND SHAPING LEAD OF SEMICONDUCTOR ELEMENT

摘要

PURPOSE:To prevent wiring leads at one side from being lifted up when bonding wiring leads at the other by bending beforehand the wiring leads on a carrier film chip by the use of a punch and a die, the punch being provided with a pair of bending blades at its bottom edge surfaces to bend the leads down to the outer side. CONSTITUTION:A die 14 has at its center an escape hole 14-c for a semiconductor element 6 and two holes at the outside of the hole 14-c for receiving stepped edge surfaces 24-a at the outer parts of the bottom of a punch 24. A carrier film chip 7 having wiring leads 5 to be bent is placed on the surface of the die 14 with the element 6 sunk into the hole 14-c. While pressing the film chip 7 with a film presser 18 perforated through a punch 24 the leads 5 are bent by pressing the punch down. In this constitution the punch 24 has a square hole 24-d for the film presser 18 to perforate and a pair of stepped bottom edge surfaces 24-a with a bending blade 24-c projected from each of the edge surfaces 24-a.