| 摘要 |
PURPOSE:To eliminate the need for a hermetic seal, by impregnating conductors with a resin, after connecting a magnetic bubble element and the wiring conductors on a base plate. CONSTITUTION:A magnetic bubble element 2 is mounted on a recess of a base plate 1 and wiring conductors on the base 1 and the element 2 are electrically connected with ultrasonic wave bonding of an Al wire 4. The conductors 3 is impregnated with a resin 6, the Al member of the bonding part which is not durable against external conditions such as humidity can be protected without hermetic seal, allowing to form a magnetic bubble memory module with high reliability simply and easily. |
