| 摘要 |
PURPOSE:To fix a semiconductor substrate with an excellent operability, by a method wherein a semiconductor substrate is inserted in a recess formed in a holder, and then a liquid electrically and thermally conductive material is charged into the recess and hardened on cooling. CONSTITUTION:The bottom of an Si substrate is fitted into a fitting part 4 of a recess 3 formed in a holder 2. An opening 5 absorbs the level fluctuation of a fixing material 6. It is possible to employ at will any fixing material excellent in electrical and thermal conductivities and having a melting point -200-500 deg.C which has no effect on the substrate 1. Particularly, such a substance is excellent in operability as taking liquid phase around ordinary temperatures and solid phase at low temperatures. Moreover, the fixing material may be a substance which is liquefied on heating. Preferable fixing materials are substances which will not form any compounds, alloys and the like with the substrate and it is possible to employ Hg, Ga, electrolytic aqueous solution, etc. By this constitution, the substrate and the holder can be uniformly and firmly brought into contact with each other without a gap, so that it is possible to obtain a device excellent in operability as well as electrical and thermal conductivities. |
