发明名称 Method for producing a pattern plane which after build-up of metallic patterns by electroplating is planar
摘要 The invention relates to a method for producing a pattern plane (5, 15) on a metallised substrate (2, 3), the pattern plane being planar after the build-up of metallic patterns by electroplating, and the patterns (5, 15) being generated by means of photolithography and built up by electrodeposition. In order to achieve a planar surface, the photolithographic process (4, 14, 24) is used at the same time to generate the masking for generating the metallic patterns (5, 15) and for filling the gaps (24, 27) between the individual micropattern parts (5, 15) of a plane with organic or inorganic dielectric material. The masking layer (24, 27) remains on the substrate. The method is used in the producing of patterned nickel-iron planes and conductor track planes in multitrack magnetic heads having read-write elements built up by means of thin-film technology. <IMAGE>
申请公布号 DE3132452(A1) 申请公布日期 1983.02.24
申请号 DE19813132452 申请日期 1981.08.17
申请人 SIEMENS AG 发明人 WAGNER,UDO,DR.,DIPL.-CHEM.
分类号 C25D5/02;G03F7/00;G11B5/31;H01F41/34;(IPC1-7):C25D5/02;C25D3/56;C25D7/00;G03F7/26;G11B5/28;H05K3/00 主分类号 C25D5/02
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