发明名称 Method of producing an ultrasonic delay line
摘要 The ultrasonic delay line (2) contains a shaped body (6) which is connected to ultrasonic shear-mode vibrators (20, 30). According to the invention, the surface regions of the ultrasonic shear-mode vibrators (20, 30) that are to be connected to one another and the shaped body (6) are metallised using thin-film technology and then one of the surface regions to be connected is provided using thin-film technology with a solder bearing surface (24, 34) consisting of layers of a plurality of metal components in the eutectic ratio, the provision being such that in each case the individual metal components (25, 26; 35, 36) are applied consecutively in layers at a temperature below the eutectic temperature. Subsequently, said solder bearing surfaces (24, 34) are soldered above the eutectic temperature to the corresponding metallisation (10, 14). The eutectic composition of the first soldering joint is thus not produced until during the soldering process by fusing of the metal components (25, 26; 35, 36). With this method, high accuracy and reproducibility of contacting is obtained, and subsequent adjusting work is substantially reduced or becomes superfluous. <IMAGE>
申请公布号 DE3131893(A1) 申请公布日期 1983.02.24
申请号 DE19813131893 申请日期 1981.08.12
申请人 SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE 发明人 SACHS, BERTRAM, 8520 ERLANGEN, DE;DIEPERS, HEINRICH, DIPL.-PHYS. DR., 8552 HOECHSTADT, DE
分类号 H03H3/007;H03H9/36;(IPC1-7):H03H9/36 主分类号 H03H3/007
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