发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To improve effectively produce a meniscus by applying heat to the region outside of the end of a lead, thereby sufficiently melting the metal of an internal terminal. CONSTITUTION:In the step of applying heat and pressure by a jig to the internal terminal of a ceramic substrate at the outer end of a fine metal strip connected to the projected electrode of a semiconductor chip to melt and connect the strip to the terminal, the outer edge of the jig is disposed outside the terminal of the strip. Heat is applied by the heating and pressurizing jig to the region exceeding the end 4' of the lead 4, thereby allowing most or the metal plated to the internal terminal 9 to melted by the radiated heat, thereby forming a sufficient meniscus on the side surface of the lead 4 to effectively connect the lead to the internal terminal and largely increasing the manufacturing yield and the reliability of a semiconductor device.</p>
申请公布号 JPS5831545(A) 申请公布日期 1983.02.24
申请号 JP19810129050 申请日期 1981.08.18
申请人 NIPPON DENKI KK 发明人 MIYAMOTO TAKASHI
分类号 H01L21/60;(IPC1-7):01L21/60 主分类号 H01L21/60
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