| 摘要 |
A system for connecting an LSI device to a printed circuit board comprising a leadless ceramic carrier 11, a leaded socket 20 and a cover member 50 wherein contact is made between the LSI device and the printed circuit board through staggered rows of closely spaced contact pads on the surface of the carrier 11 and contacts 40 contained in the socket 20. The LSI device is positioned within a recess 12 in the carrier which itself is seated within a recess 33 in the socket 20, staggered rows of contact areas 41 abutting the carrier contact pads. The cover member 50 presses the carrier 11 onto contact areas 41 and also serves to dissipate heat generated. <IMAGE> |
