Method for producing printed circuit boards with punched holes having metallized walls

摘要

A method for producing printed circuit boards with holes having walls provided with a metal coating on base material provided with an adhesive layer which, in turn, is covered by a masking foil composed of plastic material or metal. Following the preparation of the pattern of holes and prior to the removal of the masking foil, the layer of adhesive coating is removed at the edges of the holes by chemical action, so that an annular zone free of adhesive is formed underneath the masking foil. The masking foil is subsequently removed and the metallization of the pattern of conductors and walls of the holes is produced by currentless deposition alone or combined with galvanic precipitation.