Composite diamond compact for a wire drawing die and a process for the production of the same

摘要

The present invention relates to a composite diamond compact for a wire drawing die, in which a part or all of the circumference of a diamond sintered body is surrounded by a cermet consisting of a hard compound of (Mo, W)C type carbide crystals containing molybdenum as a predominant component, bonded by an iron group metal, and the binder phase of the diamond sintered body contains an iron group metal and fine carbide crystals containing molybdenum as a predominant component.