| 摘要 |
PURPOSE:To manufacture a large board readily, by individually manufacturing small boards from small wafers which are cut into the different sizes, bonding the small board together by aligning through holes which are formed in said small wafers beforehand, thereby simplifying the manufacturing process of the large board. CONSTITUTION:The perforated board supports mercury balls for electrically connecting microconnectors used for mounting the superconducting element. When said board is manufactured, a substrate is cut into a silicon wafer 2 and a silicon wafer 4 whose size is slightly different from that of the wafer 2. Through holes 3 and the aligning through holes 5 are formed in said silicon wafers 2 and 4 beforehand. Said silicon wafers 2 and 4 are bonded and the small board is individually manufactured. Then two small boards are used, alignment is performed with the through holes 5 as a reference, the overlapped parts of the two small boards are bonded by bonding agent and the like, and the large board is completed. Therefore, the special device and the manufacturing process for manufacturing the long wafer are omitted, and the large board can be readily manufactured. |
