发明名称 AUTOMATIC SOLDERING DEVICE
摘要 PURPOSE:To economize the installation spaces of a device by providing conveyors above and below various devices for soldering operations, and connecting both by means of a downward moving device and an upward moving device thereby forming a round type carrier conveying system vertically. CONSTITUTION:Carriers 10 are conveyed continuously in a direction A with an upper conveyor 1, and pass through a foam fluxer 6, a hot wind heater 7, a preheater 8, and a soldering tank 9, whereby the printed wiring substrates, etc. loaded on the carriers are soldered. When the carriers 10 arrive at the terminal end of the conveyor 1, the carriers are moved downward in a direction B by a downward moving device 2, are placed on a lower conveyor 3 and are conveyed in a direction C. The carriers 10 arriving at the terminal end of the conveyor 3 are moved upward in a direction D by an upward moving device 4 of a station part 41 to the same height as that of a free flow station 42, then the carriers are delivered out with a device 13. The station 42 is in an area beyond the control for automatic conveying, and in said area, loading of the substrate on the carriers, unloading of the soldered substrates therefrom, etc. are carried out by manpower.
申请公布号 JPS5829569(A) 申请公布日期 1983.02.21
申请号 JP19810125936 申请日期 1981.08.13
申请人 SHIIBERU KIKAI KK 发明人 HORII SEIJI
分类号 H05K3/34;B23K1/08;B23K3/06 主分类号 H05K3/34
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