发明名称 BONDING METHOD FOR DIELECTRIC FILM
摘要 PURPOSE:To obtain a smooth bonded surface which has no stepped difference of dielectric films of multilayer structure by covering a heat softening substance on the surfaces to be bonded of the films when bonding the films, superposing the films, and applying a supersonic wave to the films while applying a pressure to the films from a supersonic horn. CONSTITUTION:When transfer type recording media each of which has a supporting layer 30 and a recording layer 22 made of polyethylene terephthalate films and a resistance layer 21 made of acrylic resin are bonded, the end portions to be bonded of the media are covered with the same acrylic resin film as the material of the layer 21 of the medium, are superposed, are placed on a lower bearer 2, a supersonic wave is applied while pressurizing the media from a supersonic horn 1, thereby bonding the media. In this manner, the smooth bonded surface which has no stepped difference of the media can be obtained, and clogging of toner or the like can be prevented. A further smooth bonded surface can also be obtained by providing a supersonic energy buffer material 25 between the bearer 2 and the media to be bonded.
申请公布号 JPS5828340(A) 申请公布日期 1983.02.19
申请号 JP19810113282 申请日期 1981.07.20
申请人 FUJI XEROX KK 发明人 WAKOU MASAJI
分类号 B29C53/00;B29C65/00;B29C65/08;B29L9/00;G11B9/08;G11B23/00 主分类号 B29C53/00
代理机构 代理人
主权项
地址