发明名称 HIGH FREQUENCY FUSION-BONDING METHOD FOR HARD AND SOFT THERMOPLASTIC SYNTHETIC RESIN THIN PLATES
摘要 PURPOSE:To readily and safely fusion-bond an insulating sheet, hard and soft thermoplastic synthetic resin thin plate and sheet by sequentially disposing the insulating sheet, the thin plate, the sheet and an upper electrode on a lower electrode, applying a high frequency voltage thereto and processing a special treatment. CONSTITUTION:A hard thermoplastic synthetic resin thin plate 5 and a soft thermoplastic synthetic resin sheet 6 are superposed one upon another on a lower electrode 4 with the plate 5 disposed at the lower side, and a thick paper core material 7 is inserted between the plates 5 and 6. Subsequently, an upper electrode 3 is pressed down to press the lower end surface of the electrode 3 on the upper surface of the sheet 6 under the prescribed pressure to the outside portion of the peripheral edge of the material 7, and a high frequency voltage is applied to the electrodes 3 and 4. Then, the voltage is interrupted immediately before the electrode 3 reaches the upper surface of the electrode 4, and the excessive part 8 of the outside of the electrode 3 is removed by a tearing-off method at the plate 5 and the sheet 6. Thereafter, the upper electrode is returned to the original position, and the thin bonded part 9 is curled by its own force at the low oblique surface 1 of the electrode 3.
申请公布号 JPS5828329(A) 申请公布日期 1983.02.19
申请号 JP19810119736 申请日期 1981.07.30
申请人 NISHINO KAZUICHI 发明人 NISHINO KAZUICHI
分类号 B29C65/00;B29C37/04;B29C53/00;B29C65/02;B29C65/04;B29C65/74;B29L9/00 主分类号 B29C65/00
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