WATERPROOF TYPE PHOTOSEMICONDUCTOR RECEPTACLE

摘要

PURPOSE:To obtain waterproofness and moistureproofness of a photosemiconductor receptacle with almost no loss of optical characteristics by sealing the lead wire sides of the photosemiconductor element from the roots of the lead wires to the necessary positions for waterproofness and moistureproofness. CONSTITUTION:The lead wire side of a light emitting or photosemiconductor element 3 is formed in an airtight structure with a packing 10 and a receptacle body 5 by inserting a packing 10 opened with a hole for passing the lead wire and applying pressure via a spacer 6. Further, the space between the periphery of the spacer 6 and the body 5 and the through hole 7 of the spacer are sealed with waterproof and moistureproof adhesive or the like. Further, the optical guide 1 side of the element 3 is sealed with O-ring around the element 3 so as not to contact with the moisture at the metal part. Then, a semiconductor chip is not deteriorated for the characteristics with the moisture.